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Sunday, September 5, 2021

ESP8266 - Chip Die Layout

September 05, 2021 0

ESP8266 - Chip Die Layout

The ESP8266 is a low-cost Wi-Fi microchip, with a full TCP/IP stack and microcontroller capability, produced by Espress if Systems in Shanghai, China. The chip first came to the attention of Western makers in August 2014 with the ESP-01 module, made by a third-party manufacturer Ai-Thinker. This small module allows microcontrollers to connect to a Wi-Fi network and make simple TCP/IP connections using Hayes-style commands. However, at first, there was almost no English-language documentation on the chip and the commands it accepted. The very low price and the fact that there were very few external components on the module, which suggested that it could eventually be very inexpensive in volume, attracted many hackers to explore the module, the chip, and the software on it, as well as to translate the Chinese documentation. The ESP8285 is an ESP8266 with 1 MiB of built-in flash, allowing the building of single-chip devices capable of connecting to Wi-Fi. These microcontroller chips have been succeeded by the ESP32 family of devices, including the ESP32-C3


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Tuesday, August 31, 2021

GPDK 45nm For Self Training

August 31, 2021 1

Generic 45nm Salicide 1.0V/1.8V 1P 11M Process Design Kit and Rule Decks (PRD) Revision 5.0


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DISCLAIMER : The information contained herein is provided by Cadence on an "AS IS" basis without any warranty, and Cadence has no obligation to support or otherwise maintain the information. Cadence disclaims any representation that the information does not infringe any intellectual property rights or proprietary rights of any third parties. There are no other warranties given by Cadence, whether express, implied or statutory, including, without limitation, implied warranties of merchantability and fitness for a particular purpose.


STATEMENT OF USE : This information contains confidential and proprietary information of Cadence. No part of this information may be reproduced, transmitted, transcribed,stored in a retrieval system, or translated into any human or computer language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual, or otherwise, without the prior written permission of Cadence. This information was prepared for informational purpose and is for use by Cadence customers only. Cadence reserves the right to make changes in the information at any time and without notice.


RELEASE NOTES FOR THE 45nm GPDK
VERSION 5.0 (22 FEB 2016)
  • gpdk045 IC617 library built natively with IC6.1.7 ISR1 release code
  • Following CCRs has been fixed (16 ccrs) 1515221,1515134,1515215,1513805,1503698,1485808,1480053,1471257, 1445571,1429834,1400157,1345956,1324264,1304331,1302228,1291339
  • Modified PVL LVS deck for post-layout check. Removed "R" from property check and netlist
  • CDL netlist of resistor modified. Removed "R" parameter from netlist
  • File cph.lam has been modified
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